Inline 装备

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  • inline System
  • inline System

▷ 随着基盘的移动完成沉积封装工艺的一种具有优秀生产性能的直列型系。
▷ 适合于OLED照明芯片。

Specification
Deposition Type In-Line Horizontal Type
Substrate Size Mass : ~ Gen.5.5
R&D ~ P/P : ~ Gen.2
Tact Time Mass : 2mins
R&D ~ P/P : 30mins
Evaporation Source Mass : Linear Source
R&D ~ P/P : Parallel Shot by Point Source
Thickness Uniformity Organic : ≤± 3%(Organic), ≤± 4%(Metal)
Align Accuracy Mechanical Align : ≤± 150㎛